High Precision, High rigidity Ceramic and Quartz grinding machine.
Purposely Designed for semi-conductor manufacturing market.
Capacity
Swing Over the Bed 39.38″
Swing Over the Cross Slide 32.29″
Max. Grinding Diameter 32.29″
Max. Grinding Length 13.39″
Spindle
Spindle speed 1,000 rpm
Spindle Nose A2-6
Spindle Bore 3″
Main Spindle motor (Cont./Max) 10.06/14.76
Travel
Axis Travel (X/Z) 20.08″/19.69″
Guide ways Box Guide
Rapid Traverse Rate (X/Z) 629.93/629.93 inch/min
Grinding Spindle
Spindle Speed 6,000 rpm
Spindle Motor (cont/max) 3.7/5.5 hp Tool Shank Type BBT40
Spindle Lubrication and Cooling Grease encapsulation
ATC (Optional)
Max Number of Tools 2
Tool Change Method Double Arm Swing
General
Floor Space (L×W) 102.09″ x 78.86″
Machine Weight A [B] 10,803 lbs.
Controller Fanuc 0i-TF+
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